HDI PCB manufacturing — matched to the right manufacturer.
Upload your HDI design. We check your files for free and match you with a manufacturer in our network experienced in microvias and sequential lamination.
The technology
How HDI PCBs are built
An HDI PCB (high-density interconnect) uses laser-drilled microvias, fine lines and sequential lamination to route more connections in less space than a standard multilayer board. Build-up layers are added in steps on a core, and vias can be placed directly in component pads. For a full technical explanation of microvias, build-up structures and the IPC-2226 types, see our HDI glossary guide.
On this page we focus on getting an HDI board quoted and built correctly. HDI processes differ considerably between manufacturers, so matching your build-up structure to a manufacturer that runs it routinely matters for yield and cost. Our network includes manufacturers experienced in HDI, from single build-up structures to more complex stacked-via builds.
Applications
When to choose an HDI PCB
HDI is usually driven by component density rather than preference. Typical reasons and applications:
- Fine-pitch BGAs and CSPs that cannot be fanned out with through-hole vias.
- Compact devices such as wearables, handheld instruments and communication modules.
- High-speed designs that benefit from shorter via stubs and tighter layer spacing.
- Reducing layer count or board size compared with a conventional multilayer design.
- Designs that need via-in-pad to place decoupling close to the device.
- Products where weight and thickness must be kept to a minimum.
Design for manufacturing
HDI PCB design tips
- Choose the build-up structure early (for example 1+N+1, 2+N+2 or any-layer, which correspond to IPC-2226 Types I–III), because it drives cost and manufacturer choice.
- Prefer staggered microvias where space allows; stacked microvias need copper-filled vias and add process steps.
- Specify via-in-pad as filled and capped (plated over) so solder does not wick into the via during assembly.
- Keep microvia aspect ratios low and avoid unnecessary layer spans, which improves plating reliability.
- Agree the stack-up and impedance targets with the manufacturer before final routing.
- Limit the number of sequential lamination cycles; each extra cycle adds cost and risk.
Our free DFM check and the manufacturer's own engineering review help catch issues like these before production.
Checklist
What to send for an HDI PCB quote
- Gerber or ODB++ data
- A separate drill file per drill span (laser and mechanical)
- Stack-up with the build-up sequence
- Via types: blind, buried, stacked, staggered, filled or via-in-pad
- Impedance table
- Required IPC class
- Surface finish
- Quantity (prototype and expected production volume)
Upload your Gerber files. Get a free PCB quote.
We check your files for free and compare manufacturers in our network to find the best match. No obligation.
- Free quote
- Free DFM check
- 12 vetted manufacturers
What happens when you upload?
One of our engineers checks your Gerber files with our in-house DFM tool and emails you any findings within 72 hours. We then compare manufacturers in our network that fit your spec and send you the quote from the best match. Files are shared only with manufacturers we select, under NDA.
- Upload your Gerber files
- We check your files
- We compare manufacturers
- You get your quote
Free for you — you order directly from the manufacturer.
Common questions
HDI PCB quote FAQ
What is the difference between HDI and a standard multilayer PCB?
A standard multilayer PCB connects layers with mechanically drilled through-holes, plus occasional blind or buried vias. An HDI PCB adds laser-drilled microvias, finer lines and sequential lamination, so connections can be routed between adjacent layers and directly in pads. This frees routing space for dense components such as fine-pitch BGAs, at a higher cost per board.
What information do I need for an HDI PCB quote?
Send Gerber or ODB++ data with a separate drill file for each drill span, so laser and mechanical drilling are clearly defined. Add a stack-up showing the build-up sequence, the via types used (stacked, staggered, filled or via-in-pad), an impedance table if needed, the IPC class, surface finish and quantities. Complete data avoids rounds of questions and lets the manufacturer quote the right process.
Are stacked or staggered microvias better?
Staggered microvias are generally more reliable and less costly, because each microvia lands on a pad rather than on another via. Stacked microvias save routing space but must be copper-filled and add process steps, and stacks of many levels need careful qualification. Use staggered vias where space allows and stacked vias where density requires them.
How can I reduce the cost of an HDI PCB?
Use the simplest build-up structure that routes the design, since each lamination cycle adds cost. Prefer staggered over stacked microvias, limit via-in-pad to where it is needed, and avoid unnecessary layer spans. Panel-friendly board dimensions also help. Agreeing the stack-up with the manufacturer early avoids redesigns, and our free DFM check and the manufacturer's own engineering review help catch cost-driving features.
Specialist boards