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Fabrication

Stack-up

A PCB stack-up is the cross-sectional arrangement of copper layers, dielectric materials, and bonding films that make up a multilayer board. It defines layer thickness, copper weight, dielectric properties, and is critical for impedance control, signal integrity, and manufacturability.

What it is

For a single or double-sided board, the stack-up is trivial: a single core with copper on one or both sides. For multilayer boards, the stack-up becomes a stack of cores (cured laminate with copper) bonded together by prepreg (uncured B-stage resin) under heat and pressure. A typical 4-layer board uses one core in the middle with prepreg between it and the outer copper foils.

A complete stack-up specifies the order and thickness of every layer, the copper weight on each layer (typically 18 µm / 0.5 oz, 35 µm / 1 oz, or 70 µm / 2 oz — European specifications usually quote µm directly), the dielectric material and thickness between layers, and any blind or buried via structures. For controlled-impedance designs, the stack-up also defines the trace width and spacing required to achieve target impedances on signal layers.

Most fabricators publish standard stack-ups for 2, 4, 6, and 8 layers using common FR-4 thicknesses. Using a standard stack-up is faster to quote, cheaper to build, and avoids material lead time. Custom stack-ups are necessary for unusual layer counts, controlled-impedance designs with specific targets, or mixed-material boards (e.g. FR-4 plus Rogers).

When it matters

Stack-up choice affects manufacturability, cost, lead time, and signal integrity. Choosing a non-standard stack-up — for example, requesting an unusual prepreg thickness for impedance control — can add days to lead time and require minimum order quantities to justify material setup. Conversely, specifying the wrong stack-up for a high-speed design can cause signal integrity failures that are only discovered after assembly. For any design with controlled-impedance requirements or high-speed digital interfaces, the stack-up should be specified explicitly with impedance targets, not left to fabricator default.

At Nordic PCB

For standard 2, 4, 6, and 8-layer boards, our certified suppliers use established stack-ups with documented impedance targets — request these by specifying layer count and dielectric requirements. For custom stack-ups including controlled impedance, mixed materials, or unusual layer counts, our DFM review verifies manufacturability and we return a stack-up diagram with the quote for your approval before production.

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Last updated: 22 May 2026